Is it possible to use via in pad capability in DesignSpark PCB Pro 10 to place a via in a BGA pad?
This may sound obvious, however, I'm using a 0.4 mm pitch BGA part and there's not enough room between BGA pads to route traces. So, my only recourse is to route traces on the top layer from the outer row of pads, then place via in pad on the 2nd row (from the outside) and only run these vias to the next layer down...and so on.
Is this supported by DesignSpark PCB Pro 10?
Like I said, this may sound obvious. I am new to BGA layout.
Can I edit the PCB symbol to include the appropriate via in pads and then place this in the library?