Hello,
I am designing a card. I have several supply coppers on my top layer. When I pour the copper I have thermal reliefs that appear on the vias and pads of my components connected to the power supplies. I would like to remove the thermal reliefs on the vias only. I can't choose not isolated in the properties of vias because I want to have thermal reliefs in my internal layer (I have a supplies layer).
Could you help me please. Thanks