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How remove the thermal reliefs on the vias and not on the component pads


lguyat
Hello,

I am designing a card. I have several supply coppers  on my top layer. When I pour the copper I have thermal reliefs that appear on the vias and pads of my components connected to the power supplies. I would like to remove the thermal reliefs on the vias only. I can't choose not isolated in the properties of vias because I want to have thermal reliefs in my internal layer (I have a supplies layer).

Could you help me please. Thanks
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