How remove the thermal reliefs on the vias and not on the component pads
I am designing a card. I have several supply coppers on my top layer. When I pour the copper I have thermal reliefs that appear on the vias and pads of my components connected to the power supplies. I would like to remove the thermal reliefs on the vias only. I can't choose not isolated in the properties of vias because I want to have thermal reliefs in my internal layer (I have a supplies layer).
Could you help me please.
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You can't change properties on a per layer basis, so you either have thermal relief or not.
Why do you not want thermal relief on the top layer?
If you want you can add a copper filled shape on the top layer over the vias area which should fill the thermal relief gap.