This tutorial requires:
DesignSpark PCB V11.0.0Balancing the use of copper across each layer and between layers of your PCB can help avoid manufacturing issues such as warping or twisting of the PCB. Uneven copper distribution can also affect the plating success for through plated holes. Here we illustrate the copper coverage report* such that you are aware of the total approximate copper coverage by layer to assist you in making an assessment of the copper balance in your design.
*available only in the Engineer plan
Generating the report.
From the PCB Editor view select Output - Reports from the menubar.
Select "Reports" and from the long list of reports available select "Copper Coverage" and click <Run>.
The report is now generated.
This provides a breakdown of the approximate areas of copper by layer and also the percentage covered.
How can You improve the distribution?
One of the key areas to assess is any copper pour areas.
For example, can any solid areas be reduced in their copper area by using another Engineer feature and be changed to a hatched pour?
For any areas that are low in copper coverage could the design benefit from additional copper pour areas?
Additional reading
There are further online resources about copper coverage and balancing available from many manufacturers, here are two which will prove useful:-
Copper balance: Copper balance - Multi Circuit Boards (multi-circuit-boards.eu)
Tool and tips for good copper distribution: The Influence of Copper Distribution on PCB Quality - Eurocircuits
Acknowledgment and copyright to Multi Circuit Boards and Eurocircuits.
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