Change isolation gap between pad and copper layer
I have a pad in teh middle of a copper layer, It is isolated but I need to make the gap between the pad the the copper layer bigger on the entire board - effectively more isolation from holes to pads - how can I do this please?
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The isolation gaps between the copper pour and pads, vias, and tracks are controlled by the Spacings tab of the Design Technology settings. Enter the desired minimum spacings in the corresponding columns of the Shapes row of the Spacings tab of the Design Technology settings before doing the copper pour.