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Change isolation gap between pad and copper layer

I have a pad in teh middle of a copper layer, It is isolated but I need to make the gap between the pad the the copper layer bigger on the entire board - effectively more isolation from holes to pads - how can I do this please?

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April 18, 2019 07:20

Please also see the first of our new videos which covers the basics of the copper pour and is currently on the the DesignSpark PCB start page.

https://www.rs-online.com/designspark/designspark-pcb-copper-pour-basics-part-1

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April 18, 2019 07:19

thanks Bradley

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April 18, 2019 07:20

Attached is a capture of the relevant part of the design technology settings.

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April 18, 2019 07:20

The isolation gaps between the copper pour and pads, vias, and tracks are controlled by the Spacings tab of the Design Technology settings. Enter the desired minimum spacings in the corresponding columns of the Shapes row of the Spacings tab of the Design Technology settings before doing the copper pour.

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