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PCBs are boards made of a non-conductive material which has conductive lines printed or etched on it. Electronic components are mounted on the board, and the traces connect them to form a working circuit. An effective PCB design is vital in determining the performance of any device. There are many parameters which affect the efficiency of a PCB.
A small connector footprint makes the PCB design less complicated along with reducing the cost. As data rates are rising exponentially, the signal losses at the time of insertion are very critical. Internal structure and the contacts of the connectors play a significant role in improving the signal strength and reducing the insertion losses. Improving the airflow and channel impedance can also enhance the signal interface.
A small contact pitch reduces the size of the connectors and thus facilitates smaller boards and backplanes. For instance, connector receptacles can be mounted in parallel with a smaller pitch; the small receptacle footprint will facilitate a reduction in the connector size.
Apart from this, many industries today are demanding high speed, high-density connectors to suit a myriad of high-performance applications. BergStak® is one such offering that cannot be ignored. BergStak®has continued to maintain its popularity and demand since its introduction.
The product range originally was introduced as BergStak® 0.80mm, one of the most flexible solutions in the market for high-density applications. Later, the product range was further extended to meet the needs of advanced applications.
For 0.80mm pitch, BergStak+™ is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. Also, the 0.80mm pitch is extended to a “Lite” version called BergStak® Lite and is the most economical solution for applications that require less stringent requirements.
BergStak® Lite 0.8mm is a comprehensive, versatile and flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 4 sizes up to 100 positions. This version uses Gold Flash plating that can meet up to 50 mating cycles while extending the mechanical advantage of the standard BergStak® 0.80mm. The stack height flexibility of BergStak® Lite 0.8mm supports evolving designs and emerging mechanical requirements with a common mating interface.
Electromagnetic interference (EMI) and electrostatic discharge (ESD) shielding are significant for higher data rates. Special mounting and termination mechanisms ensure protection against the EMI and ESD effects. This should be considered while choosing connectors for your PCB.
Shielded and right angle configurations are also introduced to complement the current offering.
Choose a flexible, robust, and durable connector from our range of board-to-board and wire-to-board connectors for your PCB.