Designing my first board I checked my solder mask layer. It seems to be 'inverted' from what I expected. i.e. solder pads appear to have the mask applied over them, tracks and the copper pour areas don't. Is this correct?
Designing my first board I checked my solder mask layer. It seems to be 'inverted' from what I expected. i.e. solder pads appear to have the mask applied over them, tracks and the copper pour areas don't. Is this correct?