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Automatic solder paste openings as an option


jayx

Currently solder paste layer (openings for the stencil) is generated automatically. There is an option to add more, but what’s generated automatically can’t be removed. It’s fine in the most cases for standard components, but not necessarily for some non-standard, especially with non-standard copper lands.

It will be very useful to have full control, that is to add an option to disable automatic paste opening for the SMD pads.

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