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Knowledge Item

TE Connectivity's New Ultra Low Profile Push-Push Micro SIM Connector

Posted by Jenny Wong

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TE Connectivity (TE) today launched the ultra low profile push-push Micro SIM connector which saves up to 50 percent more space than previous generation SIM connectors, prevents incorrect card insertion, and features a unique dual slanted contact pin design.

Product Features

  • Prevents incorrect card insertion
  • Dual contacts
  • Dip legs
  • Super low profile design
  • Smooth push-push function

Applications

  • Handsets
  • Tablets
  • Ultrabooks
  • Laptops
  • Personal GPS
  • Servers

Documentation & Additional Information

 


 

SHANGHAI, China –SEPTEMBER 25, 2012 – TE Connectivity (TE) today launched the ultra low profile push-push Micro SIM connector which saves up to 50 percent more space than previous generation SIM connectors, prevents incorrect card insertion, and features a unique dual slanted contact pin design. Adopted in major platforms by top-ranking mobile phone manufacturers, the connector is a strong example of how TE responds with innovative designs and comprehensive solutions to fulfill customized client demands.

"The new ultra low profile push-push Micro SIM connector is an ideal solution for most devices carrying Micro SIM cards, especially portable devices. It not only follows the market trend of smaller and thinner devices, but also helps accelerate innovation with forward-looking features," says Youichi Kashiwa, card interconnection solution product general manager, TE Consumer Devices. "To name a few, it saves as much as 50 percent space, prevents card-jamming, and provides wider tolerance between card and stopper as well as better mating performance as a result of the dual contact design."

Its smooth push-push function and detect switch help create a more secure circuit connection. The dip leg is a new design that strengthens the solder joint on the PCB board. The wider card slot design makes it compatible with major Micro SIM card standards, including those with burrs on the edge or those out of spec. Other features include a full shield to prevent EMI issues and a flat shell that facilitates “pick and place” auto assembly.

TE’s Micro SIM connector family will also soon have push-pull products available by the end of 2012. In addition, to meet special design requirement, the Micro SIM and Micro SD Combo connector is an ideal choice for consumer electronics with limited PCB space by vertically stacking the two connectors.

For more information, please visit http://www.te.com/products/simcardconnectors-PR

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